2021 CHIP SEALING The City of Omro will receive sealed bids for 2021 Chip Sealing until 12:00 pm Wednesday, May 26th, 2021. Details regarding the specifications are below. All bids shall be submitted in a sealed envelope labeled "Sealed Bid for 2021 Chip Sealing" and show the name and address of the bidder. The sealed bid envelope shall be addressed to: City of Omro Administrator, 205 South Webster Avenue, P.O. Box 399, Omro, WI 54963. The contract letting shall be subject to the provisions of section 62.15, 66.29 and 66.23 Wis. Stats. Requires 5% Bid Bond. No bid shall be withdrawn after the opening of the bids without the consent of the City of Omro for a period of sixty (60) days from the scheduled time of the closing of the bids. The City of Omro reserves the right to reject any and all bids and to waive any informality in the bidding process.